Printed Circuit Boards
PCBs are the backbone of modern electronics, and designing them is something I’m passionate about. Shown here are a few representative examples of my work. Each design reflects a different set of constraints, mechanical packaging, thermal performance, signal integrity, and EMI/EMC, each solved with a system-level mindset.
High-Speed Digital
12-Layer 4/4 8mil Fine Pitch BGA, Controlled Impedance.
Mixed-Signal
6-Layer 6/6 8mil 28 Channel Silicon Photomultiplier (SiPM) Interface. Transimpedance amplifier frontend, pulse shaping & sub-nanosecond time-to-digital conversion.
Wearable Compute
6-Layer 6/6 8mil Multiple Integrated Laser Engagement System (MILES). STM32 Firmware, LCD Display, Battery powered, audio-amplifer.
Thermal Management
2-Layer Aluminum-Backed 10/10 LED Illuminator. Essentially, a 14mil thin PCB with a 47mil aluminum backing, very effective for thermal management. DC/DC LED Driver and 8-pin microcontroller firmware.
Rapid Prototyping
2-Layer GNSS/microSD 8/8 10mil Milled with LPKF machine. PCA build time less than 8 hours. Successfully flown on high-altitude balloon project.
High-Density
14-Layer 4/4 Blind/Buried 3mil Laser Drilled. Developed low-power DSP firmware, compression, BT interface & software.
Multi-Tenant Design
Snap-to-assemble design to meet unique packaging constrains, streamline assembly, leadtime and minimize cost.
Tiny
Low-power microccontroller, sensor and RF transmitter for environmental monitoring application.
Large
48 Port PoE/Clock Sync Distribution. FPGA/Microblaze, Controlled Impedance, DC-DC Converter, 19" 1U Rack-Mount.
Handheld
Smart Controller Gun for Army Training. Low-Power, Graphic LCD, MSP430->PIC24FJ, AA-powered, Audio Amplifier, High-Power IR Emitter & Foreign Language Support.
High-Volume
Architected automotive IoT device; LTE, WiFi, BLE, GNSS, iMX6, Linux. Deployed to major OEMs.
Polyimide PCB
A purpose-built illuminator designed for demanding, specialized applications.
RF Design
Long-range low datarate RF beacon with unique PIFA antenna.
Flex-to-Install
This stackup is 12 layers with the center two layers exposed FR-4. Less expensive than Polyimide and designed for just enough flex operations for installation.
PCB-as-Package
This board forms the heart of a battery powered device. V-groves, slots and tabs conspire to replace what would be several additional mechanical components.
Fan Favorite
This design consists of 4 different PCBs functioning as a NI matrix breakout board eliminating what would normally be a rats nest of cables.
Fine Pitch BGA
This is another fine pitch design with 4 mil microvias and 6mil trace and space.
Standard FR4 HASL
A typical design. 8-mil drills, 8mil trace/space, 62mil thickness, 6 layers.